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Avery Dennison > News and Events

News and Events

The latest on what’s happening in the world of Avery Dennison Label and Packaging Materials.

2025

Direct Thermal Linerless Solution from Avery Dennison is approved by Toshiba Tec Singapore for their All-in-One Printer

Avery Dennison invests in Series B funding of 3D Current Collectors manufacturer Addionics

Avery Dennison opens its first India-based RFID production facility & unveils unique inlay innovation to meet local customer needs

Avery Dennison’s DT Linerless solution is now officially compatible with a Star Micronics printer model

Unlocking Growth and Sustainability: How Packaging Powers Circularity for Consumer Packaged Goods Companies

Avery Dennison unveils Premium Labels to elevate packaging for luxury brands in India

2024

Pioneering adhesive innovation for a sustainable future

Saurabh Agarwal highlights Avery Dennison's Innovation

Labelexpo India Press Release-2

AD Connect Thailand

Avery Dennison Set to Impress at LabelExpo India 2024

Avery Dennison's CleanFlake™ Technology Hits New Milestone

Avery Dennison's CleanFlake™ Technology Hits New Milestone

Avery Dennison launches AD InsightX as a State-of the-Art Industry Platform, to foster Ideation

LMAI hosted a seminar on The Future of EPR & Sustainable Waste Management at the Radisson Blu Hotel, Bangalore

Avery Dennison at Label Yatra: Elevating Shelf Appeal with Label Solutions

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