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Avery Dennison > News and Events

News and Events

The latest on what’s happening in the world of Avery Dennison Label and Packaging Materials.

2026

$540 billion global food waste bill exposed for 2026

2025

Avery Dennison and Indian Institute of Packaging Sign MOU to Launch Management Development Programme for the Packaging Industry

Avery Dennison will showcase its innovative materials and intelligent label solutions at the LabelExpo Asia 2025.

Avery Dennison hosts the third edition of AD.Connect, focusing on premiumization in beverage packaging.

Avery Dennison invests in Series B funding of 3D Current Collectors manufacturer Addionics

Avery Dennison opens its first India-based RFID production facility & unveils unique inlay innovation to meet local customer needs

Avery Dennison’s DT Linerless solution is now officially compatible with a Star Micronics printer model

Unlocking Growth and Sustainability: How Packaging Powers Circularity for Consumer Packaged Goods Companies

Avery Dennison unveils Premium Labels to elevate packaging for luxury brands in India

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