09/10/2024

Avery Dennison Set to Impress at LabelExpo India 2024

Avery Dennison, an Industry leader in materials science and digital identification solutions, will return to Labelexpo India this year, bringing new innovations to enhance sustainability, optimize the supply chain, and foster stronger connections between consumers and brands.

Gurgaon, 11 September 2024 — This year, Avery Dennison is set to offer converters and brand owners across South Asia an exclusive sneak peek into their latest innovations and solutions designed to connect the physical and digital to unlock new possibilities for the labelling industry. 

"We are eagerly anticipating the opportunity to reconnect with our South Asian partners and showcase how our cutting-edge technologies can elevate their brands," said Saurabh Agarwal, vice president and general manager, Materials Group, South Asia. "Our focus this year is on presenting a suite of advanced solutions that not only highlights our next generation label technology, but also how connected packaging solutions build consumer interaction and provide end-to-end transparency."

This year's booth will showcase a range of innovative products and solutions, including the Sustainable ADvantage portfolio, which features labels designed to minimize material use and promote recycling and reuse. Additionally, the specialty portfolio will highlight labels that enhance a brand’s premium appearance and include anti-counterfeiting solutions to meet growing regulatory and safety requirements. The company will showcase innovations for emerging markets like energy storage, EV batteries, solar, and mobile, offering high-performance bonding and labelling solutions. Avery Dennison's extensive RFID portfolio will further bridge the gap between the physical and digital realms to unlock end-to-end traceability and enhance consumer engagement. Visitors will also discover unique services, including Avery Dennison’s customer portal, compliance, and their recycling program. 

"At Avery Dennison, innovation is at the heart of everything we do. Our participation in LabelExpo India 2024 reflects our dedication to driving progress within the industry and supporting our customers' efforts," added Manoj K.M., director, sales and technical services, Materials Group, South Asia. "We believe that by collaborating with our partners and sharing insights on the latest trends, we can collectively shape the future of labelling and packaging."

Visitors and customers are encouraged to participate in the knowledge sessions that Avery Dennison will host throughout the event to gain deeper insight into the industry landscape and the work Avery Dennison is doing to help to solve key industry challenges. Avery Dennison will be showcasing at Labelexpo India booth C15 where you will witness first-hand what the future of labelling holds.

Stay tuned for further updates on Avery Dennison’s exciting exhibits and demonstrations.

About Avery Dennison

Avery Dennison Corporation (NYSE: AVY) is a global materials science and digital identification solutions company that provides a wide range of branding and information solutions that optimize labor and supply chain efficiency, reduce waste, advance sustainability, circularity and transparency, and better connect brands and consumers. Our products and solutions include labeling and functional materials, radio frequency identification (RFID) inlays and tags, software applications that connect the physical and digital, and a variety of products and solutions that enhance branded packaging and carry or display information that improves the customer experience. Serving an array of industries worldwide — including home and personal care, apparel, general retail, e-commerce, logistics, food and grocery, pharmaceuticals and automotive — we employ approximately 34,000 employees in more than 50 countries. Our reported sales in 2023 were $8.4 billion. Learn more at www.averydennison.com.

 

Media Contact:

Julianna Kim

lpm.marcom@ap.averydennison.com

 

Printweek   Packaging South Asia   Labels & Labelling   Packman